電子工程網(wǎng)
標題:
PCB及PCBA缺陷中英文對照表 PCB制作流程英語(yǔ)表達
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作者:
premier_nana
時(shí)間:
2012-8-2 09:30
標題:
PCB及PCBA缺陷中英文對照表 PCB制作流程英語(yǔ)表達
1內層開(kāi)路Inner open
2內層斷路Inner short
3外層開(kāi)路Outer open
4外層斷路Outer short
5內層蝕刻過(guò)度Inner over ecthing
6外層蝕刻過(guò)度Outer over ecthing
7內層樹(shù)脂氣泡Resin void
8內層雜物Foreign material
9內層圖形移位Inner pattern mis-registration
10層與層移位Layer to layer mis-registration
11打孔不良Improper targeting
12內層蝕刻不凈Inner under etching
13露布紋Weave texture/exposure
14檫花（氧化膜面）Scratch(Oxide surface)
15板損壞Damaged board
16分層（物料）Delamination (Raw material)
17內層不配套Excessive inner core
18板過(guò)厚Over thickness
19白點(diǎn)（壓板）Measling (Pressing)
20白點(diǎn)（噴錫）Measling (HSAL)
21板曲Warpage
22板焦黃Burnt
23起皺Wrinkle
24起泡（壓板）Blistering (Pressing)
25鍍層起泡Blistering (Cu plating)
26噴錫起泡Blistering (HSAL)
27板面凹痕DENT (Pressing profilling G/F)
28白斑Crazing
29膠渣Gum residue
30孔未穿Incomplete drilling
31披鋒Burr
32多孔Extra hole
33偏孔Hole shift
3
4孔徑大Hole oversize
35孔徑小Hole undersize
36少孔Missing Hole
37塞孔Block hole
38崩孔Hole breakout
39孔粗糙(鍍銅）Hole roughness（Cu plating)
40孔粗糙（機械鉆孔）Hole roughness(mechanical drill)
41崩線(xiàn)、線(xiàn)路缺口Nick / void on trace
42缺口Nick / void on pad
43曝光過(guò)度Over-exposure
44曝光不良Under exposure
45顯影不足Under develop
46干膜脫落D/F Peel off
47干膜碎D/F Rdsidue
4
8干膜移位D/F Mis-registration
49標志不清（曝光）Illegible marking (exposure)
50錯菲林Wrong A/W
51非鍍銅孔有銅Copper in NPTH
52鍍銅孔內無(wú)銅No copper in PTH
53滲鍍Nickel smear
54電鍍粗糙Rough plating
55孔壁缺口Hole void (Cu)
56金手指顏色不良Gold Finger discoloration
57金面顏色不良Gold discoloration
58金面陰陽(yáng)色Two tone colour on gold surface
59銅、鎳脫落Copper/Nickel peel off
60銅鍍層厚度超要求Copper thickness out of requirement
61漏鍍（金手指等）Skip plating(G/F ENIG Cu)
62金面污點(diǎn)Stain on gold surface
6
3電鍍針孔Plating pits (Cu)
64鍍錫缺點(diǎn)Tin plating defect
65銅碎Copper residue
66黑孔Black Hole
67鍍層白漬Plating haze
68金手指凸出Protrusion (G/F)
69板污Board contamination
70手指套Glove mark
71褪錫不良Improper Tin stripping
72微短路Micro short
流程簡(jiǎn)介：開(kāi)料Cut Lamination－－鉆孔Drilling－－干膜制程Photo Process(D/F)－－壓合Lamination－－減銅Copper Reduction－－電鍍Horizontal Electrolytic Plating－－塞孔Plug Hole－－防焊(綠漆/綠油)Solder Mask－－鍍金Gold plating－－噴錫Hot Air Solder Leveling－－成型Profile－－開(kāi)短路測試Electrical Testing－－終檢Final Visual Inspection
PCB英語(yǔ)術(shù)語(yǔ) PCB英語(yǔ)表達 PCB制作流程英語(yǔ) PCB中英對照 PCB英語(yǔ)
更多信息 可以見(jiàn)我新浪博客哈
http://blog.sina.com.cn/u/1747420037
作者:
Cairo
時(shí)間:
2012-8-6 10:41
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