來(lái)自Kellyservices的工作機會(huì )-半導體行業(yè)資深研發(fā)經(jīng)理

發(fā)布時(shí)間:2010-8-2 10:16    發(fā)布者:步從容
來(lái)自Kellyservices的獵頭顧問(wèn)April,目前正在為一家半導體封裝行業(yè)的公司招聘研發(fā)經(jīng)理,該公司的地點(diǎn)位于美麗的蘇州工業(yè)園區,注冊資本1億美金,因公司發(fā)展需要,現招聘一位資深的研發(fā)經(jīng)理,公司會(huì )給予足夠的空間帶領(lǐng)研發(fā)團隊與之成長(cháng),附件為該職位的概括介紹,如果您對這個(gè)職位感興趣,可以予以回復聯(lián)系方式或簡(jiǎn)歷,我會(huì )盡快與您聯(lián)系。如果您不感興趣,或職業(yè)方向不適合,也希望您能將該職位推薦給適合朋友。謝謝April Bai
April_Bai@kellyservices.cn

April Bai  白蓮 | Associate Consultant- Suzhou|
Kelly Services

Tel: (86-512) 67639640     Mobile: (86) 15850168836     Fax: (86-21) 67639256
NO.8 Jinji Hu Road,Unit
0609-1,Blk1A,Singa Plaza,SIP Suzhou 215021 China

蘇州工業(yè)園區金雞湖路8號馨都廣場(chǎng)0609-1 215021


Position: RnD Manager/Director


Job Responsibility

Ø
Manages new packages development and process technology for semiconductor backend and EMS services. The work includes researching, designing, planning, developing and/or evaluating new packages and technology per customers needs define by the Business Development. Collaborate with BD and Engineering to identify priorities for new packages/technology manufacturing services. Together with BD, defines market, including competitive analysis and define packages and technology per market needs. Manage package and technology
development activities.


Ø
Manages, coordinates, and provides strategic planning of activities concerned with research and development of new or improved concepts, ideas, basic data on, and applications for organization's backend and ems services. Manages the research, identification, evaluation, and initiate development of new packages or technology.
Plans and formulate research and development proposals, such as objective or purpose of projects, applications that can be utilized from findings, cost of projects, and equipment and manpower requirements.


Ø
Reviews and analyzes proposals submitted to determine if benefits derived and possible applications justify expenditures. Submits proposals considered feasible to management for consideration and recommends allocation of funds from department budget. Monitors projects, such as preparation of records of expenditures and research findings, progress reports, and staff conferences in order to inform management of current status of each project. Keeps current on competitors' packages and services. May be responsible for the overall implementation of new packages or technology and/or improvement of existing packages or services. May engage market research firms to perform studies...


Ø
Develop measures for the evaluation of packages and new technology.


Ø
Partner with Business Development to ensure growth of packaging and manufacturing services. This includes the direct participation in the development of market plans, creation of sales collateral and training. Also partners with Operations, Finance, Customer Service and IT teams on the implementation of project.


Ø
Participate in ongoing consultation and interaction with Business Development to identify and prioritize market needs based on revenue value, market share and competitive threat.


Requirement
*
Bachelor degree and above in Mechanical / Electronic Engineering or related. Specialization in semiconductor backend technology is preferred.


*
Above 12 years product development/project, management/supervisory experience


*
Related semiconductor assembly or test Engineering process, equipment knowledge


*
Good English / Mandarin written and verbal communication


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